Hot Pressed Boron Nitride
Hot pressed BN is compacted at temperatures up to 2000°C and
pressures up to 2000 psi to form a dense, strong engineering
material that is easily machined. It is available in standard and
custom hot pressed shapes and has several unique characteristics
and physical properties which make it valuable for solving tough
problems in a wide range of industrial applications.
The unique combination of excellent electrical insulation and
thermal conductivity makes BN very useful as a heat sink in high
power electronic applications. Its properties compare favorably
with beryllium oxide, aluminum oxide and other electronic packaging
materials, yet is easier to form and finish.
High Temperature Environments
Temperature stability and excellent resistance to thermal shock
makes BN the material of choice in the toughest high temperature
environments such as equipment for plasma arc welding, diffusion
source wafers, and semiconductor crystal growth equipment &
Molten Metal Handling
BN is inorganic, inert, nonreactive with halide salts and reagents,
and is not wet by most molten metals and slags. These
characteristics, combined with low thermal expansion, make it ideal
for interface materials used in various molten metal processes.